ASU, Deca Technologies To Lead $100M SHIELD USA Project To Boost Semiconductor Packaging Capabilities

CHIPS National Advanced Packaging Manufacturing Program (NAPMP) in the US has launched several research and development programs. In one of the first such programs, Arizona State University has been selected for the SHIELD USA project.

Study in US: The U.S. Department of Commerce's National Institute of Standards and Technology has announced the award of $100 million for the SHIELD USA initiative. The funding will go to Deca Technologies and Arizona State University.

The SHIELD USA initiative aims to expand capacity for domestic advanced packaging, drive innovation in the domestic microchip packaging ecosystem, and while strengthening national security also regain US leadership in microelectronics.

“This is a critical step for U.S. semiconductor independence, and it is the area of expertise in which we are in direct competition with China to determine who will unlock the future of innovation in semiconductor chip manufacturing. ASU is well prepared with a dynamic partner in Deca Technologies, and we are eager to lead the work that will enable SHIELD USA to play a pivotal role in ensuring the country’s technological and economic future," said ASU President Michael Crow.

ASU, Deca Technologies To Lead SHIELD USA Program

The SHIELD USA (Substrate-based Heterogeneous Integration Enabling Leadership Demonstration for the USA) team will be led by Craig Bishop, chief technology officer of Deca Technologies and ASU’s Jason Conrad, SHIELD USA program director and chief operating officer of the Southwest Advanced Prototyping Hub.

The primary focus of the initiative is to improve R&D and commercial deployment, boost domestic supply chains, expand research capacity and workforce, and support US leadership in semiconductor packaging.

Deca Technologies’ Bishop said, “To bring substrate manufacturing back to the U.S., we need to change the game. More than incremental progress, we need 10X breakthroughs. This is a fantastic example of a university working in close partnership with industry to drive innovation, and we’re excited to partner so closely with ASU and to collaborate with leading industry players in this effort to reestablish technology leadership.”

Sally Morton, executive vice president of ASU’s Knowledge Enterprise commented, “By engaging key design and manufacturing partners early in the R&D process and leveraging a proven technology transfer and licensing model, SHIELD USA will cement the United States’ intellectual property position. Commercialization at multiple high-volume manufacturers will allow the U.S. to retake leadership in both state-of-the-art chip manufacturing and leading-edge semiconductor packaging.”

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