MIT ACSC Latest News & Notifications 2025 ,Alandi, Pune

Placements: On average, every year 60 to 70% of students get placed. The highest package was 7.5 LPA. Top recruiting companies are Deloitte, KPMG, Accenture, etc. On average, 70% of students get internships from the college in the internship program. The roles that the companies offer are managerial positions.

Placements: Placement opportunities for MIT ACSC graduates are not very good. Out of all the students who went for placement, only 2-3 students got placed, with an average salary of 3.5 Lacs per annum. The highest salary offered was 4.5 Lacs. Also, only a few companies like Delloite and HDFC Bank were among the big recruiters, and they did not select any B.Com students.

Placements: Placements are good in my college. There is a dedicated placement cell, and the staff there is very supportive and friendly. They guide us very well, and almost 70% of students are placed every year. The highest package offered last year was 11 LPA, and the average is 3.2 LPA. Many students also got internships.

Placements: Around 80% of students got placed in our college. The salary package offered is 10 LPA. Many companies visit our college. It is a good college. A person or student should get at least a 9 or 10 CGPA to get an internship at a good place. Internships depend not only on marks but also on personality; professionalism and communication skills are essential, which are taught here.

Placements: In my course, there are totally 300 or 350 students pursuing BCA Science now, and we are in the second year. My course has an average package, with the highest being 25 or 27 Lacs. Top companies are Amazon, Wayspire, Infosys, Tata, etc. 90 percent of students got internships from my course, mostly in Tata and Amazon.

Placements: 60% of the students were placed in 2023 with moderate packages. 8-9 companies visit the college including Wipro, TCS, Cognizant and many others. The college provides placement sessions to the students for a better performance in the interviews.