T John Institute of Technology Scholarship Details ,Bannerghatta Road, Bangalore

Placements: The percentage of students getting placed in our college is very less. The highest package received by a student was 18 Lacs, and the lowest was like 3.4 Lacs. Every student gets internships in other companies and training institutes. The roles offered in our course are like development and coding.

Placements: 10 to 15% of students were placed in my course. The highest package was 3.5 LPA, and the lowest was 1.20 LPA. Teach Mahindra and TCS were among the recruiters. 5% of students got internships at many companies, like Whirlpool and TATA. Managerial roles were offered.

Placements: 90%of students were placed in computer Science and engineering, the highest packaged received was 24 Lacs and the average package received was 4.5 Lacs and the lowest package received was 3 Lacs. Top recruiting companies were IBM, Wipro and TCS.96% students got internship .

Placements: My batch is of 2021-22. The college provides a very good placement opportunity. In my course [ISE] more than 75% of students got placed in very good companies. The highest package was INR 17 LPA. The lowest package is of INR 3 LPA. Many good companies will hire such as TCS, Infosys etc. 70% of students got internship in many good companies. Roles will be offered depending upon the student's knowledge.

Placements: In our college, most of the recruiters were start-up companies, which take only high-CGPA students and offer smaller salary packages. You should get placed by applying to off-campus placement drives, and all you have to do is gather your photos and post them on the notice board. No on-the-job or attendance will be given if you had an interview.

Placements: Almost 90% of students got placed in different reputed companies such as IBM, Infosys, etc. The highest salary package offered is 30 LPA. The lowest salary package offered is 10 LPA. Many top roles are offered for computer science engineering, artificial intelligence, machine learning, civil engineering electronics, and communication engineering.