Rayat-Bahra Institute of Engineering and Nano-Technology Reviews on Placements, Faculty & Facilities ,Punjab - Other

Placements: Our college provides various types of training for placements. Nearly 60% of the students get placed in well-reputed companies every year. Companies like Cognizant, Wipro, Capgemini, etc., visit our campus for placements. The highest salary package offered was 10 LPA, while the lowest salary package offered was 3.25 LPA.

Placements: As far as the placement scenario our senior batch is concerned, our college provide good placements in all the stream of engineering and management. Many high profile companies visit our college for placement. The highest package of our college is 10 Lacs. Starting package of our college is 3.25 Lacs.

Placements: Our Institute providing training to our batch for future placement and this year our seniors' placement are also good. About 80% students are placed in good companies. The highest salery offered is 15 Lacs p. a. and the lowest salary offered is 3.5 Lacs p. a. Companies like Wipro, Infosys, Artech, Amazon etc. Visited our college. 75% students got internship from college.

Placements: Many of the MNCs like Infosys, Wipro, TCS visit this institute for the campus placement. Many of the students in this college are working with the reputed companies. I got placed in an MNC company and am working there as business analyst, and it is a brilliant company.

Placements: 2. 70% students were placed in B.Tech course. 3. 10 lacs is the highest, 2 lacs is the lowest and 5 lacs is the average package offered. 4. Wipro, TCS and Vmware companies are the top recruiters. 6. 8.6 percent of the students got internship from our course.

Placements: Around 60% of the students got placed. The highest salary package offered is 10 LPA, the average salary package offered is 5 LPA, and the lowest salary package offered is 2.5 LPA. Top recruiting companies like Oracle, Infosys, Zensar, TCS, VMWare and Tech Mahindra visit our college. About 60% of the students got internships.