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- M.Tech. in Computer Science and Engineering SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- Master of Business Administration (MBA) SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- B.Tech. in Electrical and Electronics Engineering SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- B.Tech. in Information Technology SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- Bachelor of Computer Applications (BCA) SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- B.Tech. in Electronics and Communication Engineering SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- Bachelor of Business Administration (BBA) SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- B.Tech. in Computer Science and Engineering SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- B.Tech. in Mechanical Engineering SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- B.Tech. in Civil Engineering SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- Master of Computer Applications (MCA) SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- M.Sc. in Physics SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- M.Tech. in Structural Engineering SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- B.Tech. in Computer Science and Engineering (Artificial Intelligence and Machine Learning) SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- B.Sc. in Mathematics SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- B.Tech. in Mechanical Engineering (Lateral Entry) SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- Discontinued (Jul 2022) -M.Tech. in Production Engineering SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- M.Sc. in Mathematics SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- B.Tech. in Electronics and Communication Engineering (Lateral Entry) SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
- BBA in Business Analytics and Fintech SMIT - Sikkim Manipal Institute of Technology, Sikkim Manipal University
Placements: From the outgoing batch, 98% of the students who were interested from the EEE department got placed. The maximum package given was around 11LPA and the median was around 5LPA. The recruiting companies were Bosch, Dell, Amazon, LTE, etc. Top roles provided were of Electrical Engineer, Electrical Associate, Business Development Associate etc.
Placements: From the passing out batch, almost 98% of the students from the EEE department who were interested in placements got placed. Core companies which visit here for placements are Bosch, LTE, etc., and TCS, Wipro, Dell, etc., are among those, which visit here from the IT sector. Students who were interested in doing an internship got it. The highest salary package offered for the EEE department was 11 LPA, while the lowest salary package offered was 5 LPA.
Placements: Around 98% of the students among those interested were placed from the EEE department. The highest package received was around 11LPA and the median package received was around 5LPA. Bosch, LTE, TCS, Wipro, Amazon are some of the companies from the long list which recruited for the outgoing batch.
Placements: More than 93% of students were placed in passing out batch with the highest package around 19 LPA and the lowest was around 4 LPA with the median package around 6LPA. Top recruiting companies included Microsoft, Dell, Bosch. More than 80% of students got internships. Top roles offered were of Software Science, Electrical Engineer, Business Associate etc.
Placements: Around 98% students were placed in our batch with the highest package around 18LPA and median package being around 6.5LPA. Top Recruiting companies includes Daikin, Bosch, etc. 100% students in our batch those who applied for internship got internship and top roles that were offered were of Structural engineer, civil engineer etc.
Placements: Around 95% of the students were placed. The highest salary package offered is around 19 LPA, and the median salary package offered is around 5 LPA. Top recruiting companies included Microsoft, Dell, Amazon, etc. Around 80% of the students received internships, and various roles offered were analyst, business development associate and software engineer.
Placements: More than 95% of the students from our batch got placed. The highest salary package provided was around 19 LPA, while the average salary package offered was around 6 LPA. Top recruiting companies for our course include Microsoft, Amazon, Dell, Daikin and Bosch. More than 80% of the students were offered internships. Top roles provided were a software engineer, web developer, mechanical engineer, etc.
Placements: Around 92% to 95% of the students from our batch got placed. The highest salary package offered was around 19 LPA while the median salary package offered was around 5 LPA. Top recruiting companies for our course include Daikin, Microsoft and Amazon. More than 90% of the students were offered summer internships. Top roles offered in our course include software engineer, business associate, etc.
Placements: More than 92% students were placed in our batch with the highest package being around 18LPA and the lowest Around 4.5LPA with median around 5.5LPA. Major recruiters included Microsoft, Dell, Bosch, Amazon. The various roles offered included those of Software Engineer, Business Development Associate etc. More than 90% students offered internships.
Placements: Placement of college is very good if you are good at academics around 90 percent of my batch got placed in good firms, I did not took placements from college as I was planning to do Masters, but many who applied got really good package from college.
Placements: Around 85% students were placed in our batch with the highest package offered around 13 LPA and median around 4.5 LPA. Top recruiting companies included like Microsoft, Bosch, Dell, Amazon. More than 70% students got internship in our batch and top roles offered were those of Software Engineer, Business development associate, Electrical Engineer, etc.
Placements: Around 92% people were placed in the passing out batch with the highest package around 18LPA and median package of around 5LPA. Top recruiting companies included Microsoft, Dell, IBM, Bosch, Amazon. More than 80% students were offered internships from our batch and the top roles offered were of Software Engineer, Business Associate etc.
Placements: Around 85 to 90 percent students were placed in our batch. The highest package from our batch was around 13 Lakhs and the lowest was 3 Lakh. The median package is around 4.5 lakh. Top recruiting companies include Microsoft, Amazon, Capgemini, TCS, Dell, Bosch.
Placements: If you want a good placements then go for IT branches Core branches like civil mechanical don't have placements in their respective field. You have to take a job in any of the software company only. Rest CSE, IT, ECE branches have very good companies coming like Dell, Amazon, Wipro, Wells Fargo etc.
Placements: Placements in our college are very good. In our batch, many students had multiple job offers. Companies like Microsoft, Dell, Shell, Wells Fargo, Infosys, Wipro, Think and learn visited the campus for recruitment. We were given pre-placement training as well to help us overall. All the things from CV building to group discussions were covered.
Placements: Placements in our college for CSE course is better than other branches. Placements in our college are also good. I can't say the same about the mechanical and civil engineering branches placements. So make sure if you take CSE because the chances of getting placed in the CSE course is quite high.
Placements: 40% of them were placed. 3-10 Lacs is the window of package. AMAZON was the best company which came to my college and offered a package of around 10 Lacs. 30% of them were given the chance for internship. Software developer is the most designated position which were being offered.
Placements: All the students are placed in my college with an average 3 lac package. There are a lot of company visiting every year in our campus. Along with it provide various support in the field of career. So we can said that overall placement is good and excellent.
Placements: Around 92% of students were placed in my course. The highest salary offered was 18 Lacs and the average salary offered was 5 Lacs. The top recurring companies are Microsoft, Dell, Ixia and so on. Placement drive starts from 3rd year and internship are offered from many companies to almost 100% of the students.
Placements: Overall placement is really good. The placement percentage is around 97%. Almost everyone eligible for campus placement ends up getting a placement. Top companies like Microsoft, Dell, Amazon, etc. Come here for recruitment. The highest package offered is upto Rs2200000p. A. The average package is Rs450000. Pre-placement training is offered before placement.
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